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Hernon chip bonding adhesives

Hernon
Chip Bonding Adhesives CBA (TM)
Epoxy, Methacrylate Adhesives

Hernon offers a complete line of adhesives for bonding surface mounted devices (SMDs) to printed circuit board assemblies. SMDs include silicon chips, resistors, capacitors, transformers, and other circuit components.

These systems are one component, highly thixotropic adhesives. The thixotropic nature of the adhesives prevents migration into surrounding circuitry which could result in contamination of critical components. The compounds stay where placed.

Several application methods can be used with the CBA (TM) adhesives. Hand dispensing from syringes is ideal for smaller production runs. Automatic dispensing via pneumatic cartridge or syringe, screen printing, or pin transfer can each offer specific processing advantages, depending on production and schedule requirements.

CBA (TM) adhesives have been designed to allow component and chip flexure. Chips may be subjected to thermal cycling in an assembly. A flexible bondline prevents stressing the silicon chips and fosters better component life.

Hernon CBA (TM) adhesives do not require refrigeration like frozen epoxies. Each system is stable at room temperature.

Two types of adhesives are offered: epoxy based, heat cured types; and, methacrylate based, two step UV and heat cure systems.